At Hicomp, we are continuously pushing the boundaries of microfabrication technology, and our latest advancements in tungsten etching are no exception. Tungsten, known for its high melting point, hardness, and chemical stability, is an ideal material for micro-electromechanical systems (MEMS). However, due to these exceptional properties, machining tungsten into precise structures can be a challenge.
Through the development of an innovative Inductively Coupled Plasma (ICP) etching process, we have successfully overcome these challenges. Our process allows for the creation of tungsten microstructures with high aspect ratios and exceptional precision, making it possible to produce MEMS devices for advanced applications like microinjection, ultrasonic machining, and even medical microneedles.
Why Tungsten?
Tungsten’s properties make it highly suited for MEMS applications that require extreme durability and resistance to heat and wear. Its strength is perfect for creating fine, detailed components like microelectrodes, launch tips, and even rocket engine nozzles, making it an excellent choice for industries requiring high-performance materials.
Our Cutting-Edge Etching Process
At Hicomp, we’ve developed a unique deep etching process called WIDE (W Tungsten Inductively Coupled Plasma Deep Etching). This method offers incredible precision, allowing us to etch tungsten at depths over 300 µm with minimal surface roughness, ensuring the production of reliable, high-quality components. Our etching process also supports the creation of complex structures, such as microneedles for painless medical procedures, by achieving high aspect ratios and fine feature sizes below 3 µm.
Fig. 6. (a) Bulk tungsten mold etched by the WIDE process. (b) Schematic of non-silicon substrate machined by bulk tungsten mold. (c) A die steel micro-structure with a depth of 41.2 µm and surface roughness of Ra 190 nm machined by μ-EDM using a patterned tungsten electrode at an electrode loss rate of 37 % and machining rate of 0.48 µm/min. (d) Borosilicate glass microstructures with a depth of 56 µm, surface roughness of Ra 220 nm and minimal feature size of 11 µm machined by μ-USM using a patterned tungsten cutting tool at a machining rate of 11.2 µm/min and mold loss rate of 2.34 %. (e) Polymer spherical structures with a diameter of 31 µm molded by μ-IM using a microholes tungsten mold with a positive angle sidewall. (f) A honeycomb-like superhydrophobic polymer structure with a minimum size of 12 µm molded by μ-IM using a high aspect ratio slit tungsten mold.
Real-World Applications
Our tungsten etching process enables a variety of MEMS applications beyond silicon-based devices. From medical microneedles for blood sampling to durable molds for microfluidic devices, the possibilities are endless. Our work has also extended into machining other non-silicon materials, using tungsten molds to produce intricate, high-performance components for industries ranging from medical technology to aerospace.
The Future of MEMS
Hicomp’s advancements in tungsten etching represent a significant step forward for MEMS technology. As we continue to refine our processes, we are excited about the new opportunities this creates for innovation across industries. Stay tuned as we continue to lead the way in microfabrication!
Learn More About Tungsten Etching
If you're interested in exploring the full potential of tungsten etching for MEMS applications, we highly recommend reading our recently published paper, "Inductively Coupled Plasma Etching of Bulk Tungsten for MEMS Applications." This paper dives deep into the technical details, process optimization, and real-world applications of this breakthrough technology.
Click here to download the PDF and gain further insights!
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